SD301 Bench-top / Batch Reflow Oven
Dynamic Thermal Profile using a Batch Reflow Oven with Android™ Operating System
Match your thermal process specifications for preheat, soak, reflow, and cooling on the first PCB you produce with by using revolutionary new SD301 Batch Reflow Oven. Having the thermal conditions of an inline reflow system in a bench-top unit with a full dynamic thermal process.
The SD301 is ideal for product development, prototyping, and small series production. Solder profiles are easily set-up and stored through the control app of the SD301’s exclusive hardware control and Android operating system. The dynamic control system takes care of size and complexity of your assembly and makes it a closed loop process, something only large and costly thermal systems can normally offer. 
Real-Time dynamic thermal Control via On-Board measuring device
The SD301 has an advanced setting in which you can turn on the real time dynamic process. The unit can then via real-time feedback from the measuring system which is attached at a strategic location on the PCB surface.
The heater control and fan speed is based on the actual temperature measured on the product. The target temperature is equal to the dynamic measuring system temperature and there is no offset, making this a perfect tool for prototyping and small series.
◎ Real time temperature profile display
◎ Android system on multi-core CPU platform
◎ 7" touch screen high resolution LCD display
◎ Compact design ideal for labs, schools, prototyping and low-volume job shops
◎ WiFi temperature profile printing and data storage
◎ Real time close loop PID temperature control for leadfree profile
◎ Quick Smart programming by rising rate control (degree change per second)
◎ Infrared and forced convection combine for efficient lead-free reflow Features
| Machine Model | SD301 |
| Applicable solder types | Lead-Free and Leaded |
| PCB holding size | 350 mm x 240 mm |
| PCB effective heating area | 250 mm x 200 mm |
| Heating method | Quartz IR & Forced Hot Air Convection |
| Temperature range | Ambient - 310 °C |
| Temperature control method | Real time close loop PID temperature control for lead free profile |
| Warm-up time | approx. 2 min. |
| Computer control | Build-in dual core CPU on board computer |
| Display panel | 7" touch screen high resolution LCD display |
| Temperature control setting | Quick smart profile programming by temperature |
| rising rate control (degree change per second) | |
| Temperature profile display | Real time temperature profile display |
| Temp profile printing | WiFi temperature profile printing |
| Storage | External data storage via WiFi connection |
| Electrical | 220 V, Single Phase, 50/60 Hz, 15A |
| Power | 3000W |
| Dimensions | 690 mm L x 470 mm W x 270 mm H |
| Weight | approx. 45 Kg |
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SD301 Bench-top / Batch Reflow Oven
Dynamic Thermal Profile using a Batch Reflow Oven with Android™ Operating System